CDA-4101 Lecture 09 Notes



Sequential Circuits


Sequential Circuit State


State Variables


Clocks

  • active high means that the state changes occur at the rising edge of the clock.
  • active low means that the state changes occur at the falling edge of the clock.

a) Active high    b) Active low

Quartz Crystals

  • quartz crystal oscillator is typically used to generate the clock signal
  • quartz is a piezoelectric crystal:
    • bending the crystal causes voltages to run along its surface
    • applying voltage causes the crystal to bend
  • with right shape and voltage you get the crystal oscillating at a very precise frequency.
  • just tap into the surface voltage to get an electronic signal out of it.
  • clock frequencies typically from 32 kHz to hundreds of MHz
  • You can subdivide the clock cycles by inserting small delays. (i.e., you don't need a quartz crystal operating at 2 GHz to run a machine at that speed.)

A Bistable Element


Latches



S R Q Q'
0 0 last Q last Q'
0 1 0 1
1 0 1 0
1 1 0 0

Clocked SR Latch

S R C Q Q'
0 0 1 last Q last Q'
0 1 1 0 1
1 0 1 1 0
1 1 1 0 0
x x 0 last Q last Q'

D Latch

D C Q Q'
0 1 0 1
1 1 1 0
x 0 last Q last Q'

Truth Table Shorthand Notation

For the truth tables for the latches/flip-flops, you see things in the
notes that show:


  D  C  |     Q        Q'
 ==========================
  0  1  |     0        1
  1  1  |     1        0
  x  0  |  last Q   last Q'

First off, this is a shorthand for:

  D  C  |     Q        Q'
 ==========================
  0  1  |     0        1
  1  1  |     1        0
  0  0  |  last Q   last Q'
  1  0  |  last Q   last Q'

Then, more importantly, this table itself is itself a shorthand for
the full truth table.  The full truth table will have all the possible
inputs on the left and the outputs on the right.  For a sequential
circuit, the world of possible inputs includes not just the regular
inputs, but the current state of the circuit as well.  Thus, the full
truth table in this case is:

  D   C   current Q   current Q'   |   next Q   next Q'
==========================================================
  0   0      0           0         |     0        0
  0   0      0           1         |     0        1
  0   0      1           0         |     1        0
  0   0      1           1         |     N/A      N/A
  0   1      0           0         |     0        1
  0   1      0           1         |     0        1
  0   1      1           0         |     0        1
  0   1      1           1         |     N/A      N/A
  1   0      0           0         |     0        0
  1   0      0           1         |     0        1
  1   0      1           0         |     1        0
  1   0      1           1         |     N/A      N/A
  1   1      0           0         |     1        0
  1   1      0           1         |     1        0
  1   1      1           0         |     1        0
  1   1      1           1         |     N/A      N/A

Edge-triggered Flip Flops


Circuit to get an "edge triggering"

D Flip Flop


Real-world Latches and Flip flops


8 Bit Register



Memories

4x3 Memory


Inverting and Non-inverting Buffers


Memory Chips Example: 512K x 8

  • 8 bit cells
  • 512K Addressable locations
  • 19 address lines
  • CS = chip select
  • WE = write enable
  • OE = output enable

Memory Chips Example: 4096K x 1

  • 1 bit cells
  • arranged as an 211 x 211 matrix internally
  • 11 address lines
  • sequenced addressing: first row, then column
  • RAS = Row Address Strobe
  • CAS = Column Address Strobe
  • slower access due to addressing
  • less pins
  • this row-then-column addressing means there needs to be a register inside to remember the last row (i.e., it has its own internal state)

Static RAM (SRAM)


Dynamic RAM (DRAM)

  • most regular RAM is DRAM
  • Dynamic RAM uses a different technology (not flip-flops)
  • uses a single transitor and a very small capacitor
  • can pack many more of these into a chip than SRAM (SRAM needs 4 to 6 transitors)
  • capacitor is charged, but then discharges at a particular rate
  • to maintain memory, it must be periodically refreshed (every few milliseconds)
  • can refresh entire rows in one operation instead of having to cycle through every possible memmory location

DRAM Perspective


DRAM Types

Fast Page Mode (FPM) DRAM

Extended Data Out (EDO) DRAM (a.k.a. HyperPage Mode)

Burst Extended Data Out (BEDO) DRAM


Asynchronous DRAM


Synchronous DRAM (SDRAM)


SDRAM Speed


SDRAM Types

Standard Synchronous DRAM (a.k.a., PC-66, JEDEC)

PC-100

PC-133

Enhanced SDRAM (ESDRAM)

DDR (Double Data Rate)
  • allows the activation of output operations on the chip to occur on both the rising and falling edge of the clock
  • can effectively double the speed of operation
  • PC-100 DDR -> 200 MHz (PC-200)
  • PC-133 DDR -> 266 MHz (PC-266)


Direct Rambus DRAM (RDRAM or DRDRAM)

  • a somewhat newer specification for memory design
  • theoretically up to 800 MHz, but currently only up to 200 MHz
  • the voltage level is much lower: 0-3.3 Volts on SDRAM and 0-2.2 Volts on Rambus. It takes less time to charge( or discharge) the DRAM cell data storage capacitor to 2.2V than 3.3V
  • 4 banks of interleved memory to help pipelining
  • increased bandwidth, but not improved latency, which is the current limiting factor (memory bandwidth is typically underutilized in today's machines)
  • more overhead than SDRAM to set up an accesses
  • proprietary specification, requiring royalties, so a major obstacle to adoption

Video DRAM (VRAM)

  • video graphics have spawned the creation of several new, innovative memory technologies specifially for video RAM (VRAM)
  • based on asynchronous DRAMs
  • many of them designed to allow the memory to be accessed by the processor and read by the video card's refresh circuitry simultaneously.
  • This is called dual porting
  • faster and more expensive than other DRAMs.

ROM (Read Only Memory)

  • read-only
  • non-volatile
  • security
  • e.g., older system BIOS (non-flashable BIOS)

PROM (Programmable ROM)

  • write-once (programmable)
  • special equipment to create
  • usually use fuses that are burnt out like in a PLA
  • analogous to CD-R

EPROM (Erasable PROM)

  • erasable
  • ultraviolet light to erase
  • analogous to CD-R/W

EEPROM (Electrically Erasable PROM)

  • electronically erasable
  • can be erased and programmed in place
  • much slower than DRAMs/SRAMs (factor of 10)
  • can be done in software
  • e.g., system BIOS (flash BIOS)

FLASH Memory

  • newer type of EEPROM
  • limited liftetime (10,000 or so erasures)
  • used in cameras and many emerging applications